Hotel Deadline Extended to October 26, 2022
Twitter
#AVS68
avs68_logotype_207x46avs68_logotype_207x46
avslogo_blue_92x94avslogo_blue_92x94
  • Overview
    • AVS Code of Conduct (PDF)
    • Awards
      • Awards Ceremony
      • 2022 Awardees
    • Greetings & Introduction
    • Health & Safety Plan (PDF)
    • Organizing Committee
      • Program Chairs and Committee Members
      • Division/Focus Topic Chairs and Champions
    • Manuscripts
    • Presentation Guidelines
    • Photo Gallery
  • Technical Program
    • Technical Program (PDF)
    • Schedule of Special Events (PDF)
    • Online Scheduler
    • Mobile App
    • Symposia
      • Divisions
        • Advanced Surface Engineering (SE)
        • Applied Surface Science (AS)
        • Biomaterial Interfaces (BI)
        • Electronic Materials and Photonics (EM)
        • Magnetic Interfaces and Nanostructures (MI)
        • Nanoscale Science and Technology (NS)
        • Plasma Science & Technology (PS)
        • Surface Science (SS)
        • Thin Film (TF)
        • Vacuum Technology (VT)
      • Groups
        • 2D Materials (2D)
        • Manufacturing Science and Technology (MS)
        • MEMS and NEMS Technology (MN)
      • Focus Topics
        • Actinides and Rare Earths (AC)
        • Advanced Ion Microscopy & Ion Beam Nano-Engineering (HI)
        • Atomic Scale Processing (AP)
        • Chemical Analysis and Imaging at Interfaces (CA)
        • Fundamental Discoveries in Heterogeneous Catalysis (HC)
        • New Trends in Structural Electronic Characterization of Materials, Interfaces, and Surfaces Using Synchrotron and FEL Based Light Sources (LS)
        • Quantum Information Science (QS)
        • Radiation Effects on Materials (RE)
        • Smart Multifunctional Materials for Nanomedicine (SM)
        • Spectroscopic Ellipsometry (EL)
      • Mini Symposium
        • 2D Materials Synthesis (MS-2DMS)
    • Special Sessions & Events
      • Schedule of Special Events (PDF)
      • 5K Run
      • AVS Quantum Science Workshop
      • Career Center
      • Member Center
    • Plenary Lecture
  • Exhibit
    • Information & Opportunities
    • Prospectus (PDF)
  • Housing/Travel
    • Attendee Hotel Reservations
    • Exhibitor Staff Hotel Reservations
    • Accessibility
    • Directions & Parking
  • Register
    • Attendee Registration
    • Exhibitor Staff Registration
    • Registration Rates and Info.
  • Sponsors
    • General Sponsors
    • Division, Group, and Focus Topic Sponsors
    • Sponsorship Opportunities

Focus Topic: Atomic Scale Processing (AP)

The Atomic Scale Processing Focus Topic is aimed at providing a unique forum to expand the scope of atomic layer deposition (ALD) and atomic layer etching (ALE) processes towards understanding the fundamentals needed to achieve true atomic scale precision and the application of such processing on various areas of interest to the broader AVS community. The emphasis will be on synergistic efforts, across multiple AVS divisions and groups, to generate area selective processes as well as novel characterization methods to advance the field of processing at the atomic scale. We are excited to offer several sessions in collaboration with the PSTD, the TFD, as well as the EMPD, focusing on area selective deposition, atomic layer process chemistry, surface reactions, and atomic layer etching.

AP+2D+AS+EM+PS+SS+TF-MoM: Area Selective Processing and Patterning

  • Christophe Vallee, SUNY POLY, Albany, “Imperfectly Perfect Materials and/or Processes as a Route for ASD”
  • Rudy Wojtecki, IBM Almaden Research Center, “Peter Mark Memorial Award Talk: Reactive Inhibitory Chemistries for Area Selective Depositions and Their Application in Back End of the Line Processes”

AP+AS+EL+MS+SS-MoA: Advancing Metrology and Characterization to Enable Atomic Scale Processing

  • Thomas Grehl, IONTOF GmbH, Germany, “The Thinner, the Better – Characterization of Ultra-Thin Films by Low Energy Ion Scattering (Leis)”
  • Sung Park, Molecular Vista, “Nanoscale Chemical Analysis and Mapping of Atomic and Molecular Scale Processes via Infrared Photo-Induced Force Microscopy”

AP+AS+EM+HI+PS+SS+TF-TuM: Area Selective Processing and Patterning II

  • John Ekerdt, University of Texas at Austin, “Low-Temperature Area-selective ALD and ALE of Pd”
  • Alex Martinson, Argonne National Laboratory, “Site-selective Atomic Layer Deposition: Targeting Electronic Defects”
  • Mikko Ritala, University of Helsinki, Finland, “New Precursors and Approaches to ALD and AS-ALD of Metals”

AP+PS+TF-TuA: Thermal Atomic Layer Etching

  • Andreas Fischer, Lam Research Corporation, “Thermal Atomic Layer Etching: The Right Etch Technology at the Right Time”
  • Gert Leusink, TEL Technology Center, America, LLC, “Thermal Atomic Layer Etch Processes in Semiconductor Manufacturing Challenges and Opportunities”

AP-TuP: Atomic Scale Processing Poster Session

Diamond, Platinum, Gold, and Silver Sponsors

Logo Image
Logo Image
Logo Image
Logo Image
Logo Image
Logo Image
VIEW ALL

View Technical Program

Follow Us

Tweets by AVS_Members

Key Dates

Major Awards Deadline:
March 31, 2022

Student Awards Deadline:
May 31, 2022

Late-Breaking Abstract Submission Deadline:
September 12, 2022

Early Registration Deadline:
September 30, 2022

Hotel Deadline Extension:
October 26, 2022

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

OverviewTechnical ProgramExhibitHousing/TravelRegisterSponsors
© 2022 AVS. All Rights Reserved.