Abstract Submission Deadline is May 31, 2022
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Focus Topic: Atomic Scale Processing (AP)

The Atomic Scale Processing Focus Topic is aimed at providing a unique forum to expand the scope of atomic layer deposition (ALD) and atomic layer etching (ALE) processes towards understanding the fundamentals needed to achieve true atomic scale precision and the application of such processing on various areas of interest to the broader AVS community. The emphasis will be on synergistic efforts, across multiple AVS divisions and groups, to generate area selective processes as well as novel characterization methods to advance the field of processing at the atomic scale. We are excited to offer several sessions in collaboration with the PSTD, the TFD, as well as the EMPD, focusing on area selective deposition, atomic layer process chemistry, and surface reactions and atomic layer etching.

AP1+AS: Area Selective Processing and Patterning

  • James Ekerdt, University of Texas at Austin, “Low-Temperature Area -selective ALD and ALE of Pd”
  • Woo-hee Kim, Hanyang University, Korea
  • Alex Martinson, Argonne National Laboratory, “Site-selective Atomic Layer Deposition: Targeting Electronic Defects”
  • Christophe Vallee, SUNY College of Nanoscale Science and Engineering

AP2+AS+EL+MS+SS: Advancing Metrology and Characterization to Enable Atomic Scale Processing

  • Thomas Grehl, IONTOF GmbH, Germany
  • Harm Knoops, Oxford Instruments Plasma Technology, Netherlands, “Atomic Scale Processing for Quantum Computing”
  • Sung Park, Molecular Vista

AP3+2D+PS+TF: Atomic Layer Processing: Integration of Deposition and Etching for Advanced Material Processing

  • Sashi Vyas, Intel Corp.

AP4+AS+HI+PS+SS: Beam Studies / Surface Reaction Analysis and Emerging Applications of Atomic Scale Processing

  • Howard Fairbrother, Johns Hopkins University, “Rationalizing and Controlling the Composition and Properties of Ion Beam Deposited Materials”
  • Ivo Utke, Empa, Swiss Federal Laboratories for Materials Science and Technology, Switzerland

AP5+TF: Thermal Atomic Layer Etching

  • Andreas Fischer, LAM Research, “Thermal Atomic Layer Etching: The Right Etch Technology at the Right Time”
  • Gert Leusik, TEL Technology Center, America, LLC, USA, “Thermal Atomic Layer Etch Processes in Semiconductor Manufacturing, Challenges and Opportunities”

AP6: Atomic Scale Processing Poster Session

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Key Dates

Major Awards Deadline:
March 31, 2022

Abstract Submission Deadline:
May 31, 2022

Student Awards Deadline:
May 31, 2022

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

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