The Plasma Science & Technology Division (PSTD) program highlights state-of-the-art advances in plasma science, ranging from fundamental studies of plasma physics and chemistry to plasma-matter interactions and new applications for plasma processing. Our diverse international community includes researchers from academia, national laboratories, and industry covering topics extending from the latest advancements in plasma research for established fields such as semiconductor fabrication to newer areas of study such as energy research, novel materials synthesis, catalysis, and biomedical applications, where plasma is either the focus or the enabling tool. Abstracts describing novel research are solicited in areas concerning the topics listed below. We accept abstracts for both oral sessions and poster sessions, which provide an excellent opportunity for one-on-one discussions of new results with colleagues. Special consideration will be given to papers that highlight cross-disciplinary issues of the research. The authors are also encouraged to submit their original results to the one of the appropriate AVS journals.
PS1: Advanced BEOL: Interconnect Materials and Etching
- Theo Standaert, IBM Research
PS2+AP: Advanced FEOL: Plasma Processing for Logic Devices
- Yun Han, TEL Technology Center, America, LLC, “Plasma Etch Challenges in Logic Device Evolution from 2D to 3D”
PS3+NS: Advanced Plasma Patterning: EUV-Based, Multipatterning and Alternative Patterning Approaches (Imprint, DSA, Etc.)
- Katie Lutker-Lee, TEL, “EUV Patterning: Plasma Processing Innovations for Single Exposure and Multi-Patterning”
PS4+TF: Plasma Processing for Advanced Emerging Memory Technologies, Advanced Packaging and Heterogeneous Integration
- Shreya Kundu, IMEC, Belgium, “An Overview of Complex Metal Alloy Patterning in Sync With Semiconductor Integration”
PS5+TF: Plasma Processes of Non-Silicon Related Semiconductors for Energy-Efficient Devices in Power, Photovoltaics and Optoelectronics Applications
- Taketomo Sato, Hokkaido University, Japan, “Low-damage Etching of Nitride Semiconductors utilizing Photo-electrochemical Reactions”
PS6+AP: Plasma Assisted Atomic Layer Etching
- Dominik Metzler, IBM Research, “Use of Atomic Layer Etching Techniques in Todays and Tomorrows Industry”
PS7+AP+TF: Plasma Deposition and ALD Processes for Coatings and Thin Films
- Silvia Armini, IMEC, Belgium
PS8+SE: Plasma Sources, Diagnostics, Sensors and Control
- GIlles Cunge, CNRS-LTM, France
PS9: PSTD Award Lectures (ALL INVITED SESSION)
- Jean-Paul Booth, Ecole Polytechnique, France, “What We Still Don’t Know About Plasmas in Simple Diatomic Gases- or How to Use a DC Plasma in Pure O2 as Ideal Test-Bed for Experimental Validation of Simulations”
- Ellen Fisher, University of New Mexico, “Merging the Fundamental and Applied: Understanding Plasma Kinetics and Energetics to Build Better Mousetraps”
- Yohei Ishii, Hitachi High Technologies America Inc., “Dry Etch Solution to a Challenge in Si/SiGe Dual Channel Process Integration”
- Lawrence Overzet, University of Texas at Dallas, “Plasma ON then OFF, ON – OFF, ON – OFF, ON – OFF: Who Knew Being Indecisive Could Work So Well!”
- Floran Peeters, DIFFER, Netherlands, “Next generation “Birkeland-Eyde”: from NH3 to NO”
- David Ruzic, University of Illinois, “Time-Resolved Energy and Ion Energy Distributions during Bi-Polar High Powered Impulse Magnetron Sputtering (HIPIMS)”
PS10+MS: Modelling of Plasmas and Plasma Driven Processes, and Machine Learning
- Yu-Hao Tsai, TEL Technology Center, America, LLC, “Fundamental Study on the Selective Etching of SiGe and Si in ClF3 Gas for Nanosheet GAA Transistor Manufacturing: A First Principle Study”
PS11+AS+SS: Plasma-Surface Interactions
- Miyako Matsui, Hitachi High Technologies, Japan, “Selective Mask-Deposition for Highly Selective Etching Process”
PS12: Plasmas for the Environment and Sustainability: Plasmas-Liquid Interactions, Water, Air, Soil Treatment
- Patrick Cullen, University of Sydney, Australia, “Plasma Bubbles: A Route to Sustainable Chemistry”
PS13+AS: Plasma Chemistry and Catalysis
- Nicolas Gosset, Air Liquide, Japan, “New Etchants for Advanced Semiconductor Plasma Processes”
PS14+BI+SM: Plasma for Antimicrobial Treatment, Medicine, and Biointerfaces
- Eun Ha Choi, Kangwon University, Korea (Republic of), “Nonthermal Atmospheric Pressure Plasma (NAP) Sources for Plasma Bioscience, Medicine and Inactivation of Human Corona Virus 229E”
PS15+SE: Atmospheric Pressure Plasmas and their Applications
- Davide Mariotti, University of Ulster, UK, “Synthesis and Applications of Metal Oxides NPs”
PS16: Plasma Science and Technology Poster Session