Abstract Submission Deadline is May 31, 2022
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Division: Thin Film (TF)

The Thin Film Division offers several core oral sessions and one poster session. A broad range of outstanding invited speakers will cover the breadth of thin film science, thin film deposition, thin film interfaces, technology, and applications. We have several sessions dedicated to ALD and CVD, encompassing from surface reactions and growth mechanisms to novel processes, precursors, scale up, and emerging applications, and sessions dedicated to novel materials by a wide range of deposition processes, including epitaxial films and interfaces, PVD and solution-based methods, and the application of simulation and machine learning to thin film growth. The division also features a session on interfacial phenomena on thin film growth.  Additionally, the division has a strong focus on the application of thin films, including microelectronics, battery and spintronics applications, interfaces and contacts, flexible electronics, plasmonic, photonic, and metamaterials, energy, and catalysis. It has also a session dedicated to low dimensional materials. Specifically, to address this year’s symposium theme the division is introducing two new sessions on perfectly imperfect materials with focus on imperfectly oxides by ALD and imperfect Heusler Alloys for spintronics. Finally, the division continues its focus on organic and hybrid materials, including the modification of polymers using vapor infiltration methods and the vapor deposition of functional polymer films. Again, this year, TFD will host a student-focused session to highlight the Harper Award candidates in which the student finalists will present their work in an interactive “TED Talk” type of forum.

TF1+AP: Manufacturing and Scale-Up of CVD and (Spatial) ALD

  • Zheng Guo, Qingdao Sifang SRI Intellectual Co., Ltd, China

TF2+AP+SE+SS: ALD and CVD: Surface Reactions, Mechanisms and Kinetics

  • Laura Nyns, IMEC, Belgium, “ALD of Chalcogenide and III-V Materials for Memory Applications”

TF3+PS: Hipims for Emerging and Advanced Materials

TF4: Solution Based Thin Film Deposition Techniques

  • Daniel Gamelin, University of Washington

TF5+AP: Novel ALD CVD Precursors, Processes, Deposited Morphologies and Substrate Architectures

  • Mikko Ritala, University of Helsinki, Finland, “New Precursors and Approaches to ALD and AS-ALD of Metals”

TF6: Perfectly Imperfect Oxides: Imperfect Stoichiometry, Perfect Performance

  • Mari Napari, University of Southampton, UK, “The Electrical and Magnetic Properties of Nonstoichiometric Nickel Oxide Thin Films”

TF7+EM: Microelectronics Application

  • Ivona Z. Mitrovic, University of Liverpool, UK, “Rare Earth Thin Oxide Films for Sustainable Energy”

TF8+2D: Low Dimension Material Application

  • Stephan Hofmann, University of Cambridge, UK, “Exploration of Fundamental Mechanisms to Advance Integrated Process Technology for Atomically Thin 2D Films”

TF9: Energy Generation Application

  • Jinsong Huang, University of North Carolina

TF10: ALD for Batteries

  • Xueliang Sun, University of Western Ontario, Canada

TF11+EM: Thin Film for Spintronics

  • Vince Sokalski, Carnegie-Mellon University, “Magnetic Multi-Layer Thin Films for Future Skyrmion-Based Memory”

TF12: Perfectly Imperfect Heusler Alloys for Spintronics

  • Avik Ghosh, University of Virginia, “Designer Heusler Half-Metals for Ultra-Fast Spintronic”

TF13+SE+SS: Nucleation and Interface Phenomena in Thin Films

  • Mariona Coll, Institut de Ciència de Materials de Barcelona, Spain, “Opportunities of Complex Oxides Prepared by Atomic Layer Depositions”

TF14+MS: Simulations and Machine Learning Applications for Thin Films

  • Rafael Jaramillo, MIT

TF15+AS: In-Situ Characterization of Thin Films and Interfaces

  • Matthew Highland, Argonne National Laboratory

TF16: Growth in 3D, High Aspect Ratio and Nanostructured Materials

  • Neil Dasgupta, University of Michigan, “Tailoring Nanomaterial Interfaces Using Atomic Layer Deposition: Bridging Scales from Atoms to Bulk”

TF17+EM: Wide and Ultra-Wide Bandgap Thin Films: Advances in Deposition and Novel Materials

  • Zlako Sitar, North Carolina State University, “AlGaN, an Enabling Ultra-Wide Bandgap Semiconductor”

TF18+SE: Vapor Deposition and Vapor Infiltration of Organic, Polymeric, and/or Hybrid Materials

  • Trisha L. Andrew, University of Massachusetts – Amherst, “Chemical Vapor Deposition of Soft Materials for Wearable Health Monitoring”

TF19+EM: Thin Films for Optics, Photonics, and Metamaterials

  • Michelle Povinelli, University of Southern California

TF20+EM: Thin Films for Soft Electronics

  • Suresh Sitaraman, Georgia Institute of Technology

TF21: Thin Film Poster Session

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Key Dates

Major Awards Deadline:
March 31, 2022

Abstract Submission Deadline:
May 31, 2022

Student Awards Deadline:
May 31, 2022

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

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