Call for Late-Breaking Abstracts Deadline:
Abstract Submission Guidelines
Please review Steps 1-5 below before entering the online abstract submission site.
Step 1
Before signing up or logging into the online system (in Step 5), please review all of the following steps to ensure you have the information needed to complete the abstract submission process.
Please Note the Following Requirements Prior to Submission:
- If you are planning to submit multiple abstracts, presenters are limited to one oral and one poster presentation.
- If you already have accepted abstracts scheduled in the program, please note that you can only have one oral and one poster in the program total so please keep this in mind when submitting a late breaking abstract.
Step 2
Select a a session topic from the list below. Note that all sessions have Late Breaking Oral, Late Breaking Poster, and Late Breaking On Demand submission options (except the undergraduate poster session)
Step 3
Fill out the abstract content and author details in the system (abstract 2,700 characters max. including grammar and spacing; you may also submit a supplemental 1 page PDF file containing any graphs, charts or pictures you wish to include).
Step 4
Agree to the copyright agreement. If you have questions e-mail yvonne@avs.org.
STEP 5
Due by 11:59 p.m. ET
Author Notification
Acknowledgment that your abstract has been submitted will follow by e-mail shortly after submission. Notifications regarding late breaking acceptances will be sent by e-mail by Mid-September.
Topics
2D Materials (2D)
- 2D+AS+BI+HC+SS-FrM: 2D Materials: Biologicals, Electronic Energy and Other Applications
- 2D+AS+EM-ThA: 2D Materials: Electron Microscopy and Photoemission Spectroscopy
- 2D+AS+NS+SS-ThM: 2D Materials: Scanning Probe Microscopy and Spectroscopy
- 2D+AS+SS-MoA: 2D Materials: Defects, Dopants, Functionalizatios and Intercalation
- 2D+EM+MI+NS+QS-WeM: 2D Materials: Quantum and Symmetry-Protected States
- 2D+EM+MI-WeA: 2D Materials: Charge Density Waves, Magnetism, and Superconductivity
- 2D+EM-MoM: 2D Materials: Electronic, Mechanical and Optical Properties
- 2D+MI-TuA: 2D Materials: Heterostructures Twistronics and Proximity Effects
- 2D-ThP: 2D Materials: Poster Session
Actinides and Rare Earths (AC)
- AC+AS+LS-ThM: Emerging Topics and Methods in Actinide/Rare Earth Science
- AC+LS+MI-WeA: Chemistry and Physics of the Actinides/Rare Earths
- AC+LS+MI-WeM: Magnetism Electron Correlations and Superconductivity in the Actinides/Rare Earths
- AC-TuP: Actinides and Rare Earths Poster Session
Advanced Ion Microscopy & Ion Beam Nano-Engineering (HI)
- HI+AP-WeA: Emerging Ion Sources Optics & Applications
- HI+AS-ThM: Advanced Ion Microscopy & Surface Analysis
- HI-ThA: Novel Beam Induced Material Engineering and Nano Patterning
Advanced Surface Engineering (SE)
- SE+AS+BI+SS+TF-ThM: Nanostructured and Multifunctional Thin Films and Coatings I
- SE+AS+MN+SS-ThA: Mechanical and Tribological Properties of Thin Films and Coatings
- SE+MN+PS+TF-WeA: Vapor Deposition Technologies and New Trends in Surface Engineering
- SE+MN+PS-FrM: Nanostructured and Multifunctional Thin Films and Coatings II
- SE-ThP: Advanced Surface Engineering Poster Session
Applied Surface Science (AS)
- AS+AC+BI+CA+HI-ThM: Unraveling the Composition of Complex Systems with SIMS
- AS+BI+CA+HC+LS+PS+SE+SS-WeM: Analysis of Surfaces and Interfaces Related to Energy and the Environment
- AS+CA+EL+EM+LS+SE+SS-MoA: Quantitative Surface Analysis
- AS+CA+HC+LS-WeA: Shining a Light on Surface Chemical Metrology: In Memory of Martin Seah
- AS+EM+SE-TuA: Surface Analysis Using Complementary Techniques
- AS+LS+RE+SS-MoM: Probing Surface and Interface Structure with X-ray Photoelectron Spectroscopy: in Memory of Charles Fadley
- AS+LS+RE+SS-TuM: Synchrotron-Based Photoelectron Spectroscopy Studies of Technologically Important Materials: in Memory of David Shirley
- AS-ThP: Applied Surface Science Poster Session
Atomic Scale Processing (AP)
- AP+2D+AS+EM+PS+SS+TF-MoM: Area Selective Processing and Patterning
- AP+AS+EL+MS+SS-MoA: Advancing Metrology and Characterization to Enable Atomic Scale Processing
- AP+AS+EM+HI+PS+SS+TF-TuM: Area Selective Processing and Patterning II
- AP+PS+TF-TuA: Thermal Atomic Layer Etching
- AP-TuP: Atomic Scale Processing Poster Session
Biomaterial Interfaces (BI)
- BI+AS+HC+SS-MoA: Bioinspired Materials and Applications
- BI+AS+PS-MoM: Biomolecular Interfaces and Underwater Adhesion
- BI1+AS+EM+NS+SE+TF-TuM: Bioanalytics, Biosensors and Diagnostics
- BI2+AS-TuM: Characterization of Biological and Biomaterials Surfaces
- BI-TuP: Biomaterial Interfaces Poster Session
- BP-SuA: Biomaterials Plenary Session: Programmable Biologic Materials (ALL-INVITED SESSION)
Chemical Analysis and Imaging Interfaces (CA)
- CA+2D+AS+BI+HC+LS+NS-TuA: In Situ Microscopy, Spectroscopy and Processing at Liquid-Solid-Gas Interfaces
- CA+AS+SE+SS-TuM: Progress and Challenges in Industrial Applications
- CA5+AS+SE+SS: Progress and Challenges in Industrial Applications
- CA6+2D+AS+SE+SS: Novel Developments and Applications of Interfacial Analysis
- CA7: Chemical Analysis and Imaging at Interfaces Poster Session
Electronic Materials and Photonics (EM)
- EM+AS+EL+NS+SS-ThA: Interfaces and Defect Engineering in Electronic Photonic Materials Devices
- EM+AS-ThM: Photovoltaic Materials Characterization and Applications
- EM+MN+TF-ThM: Wide and Ultra Wide Band Gap Materials and Devices
- EM1+MN+NS-FrM: Piezoelectrics, Ferroelectrics, and Multiferroic Devices & Microelectronics
- EM2-FrM: Advanced Devices & Fabrication Methods
- EM-ThP: Electronic Materials and Photonics Poster Session
Fundamental Discoveries in Heterogeneous Catalysis (HC)
- HC+AS+NS+SS-ThA: Special Session and Reception for the HC Community and to Celebrate Robert Madix
- HC+AS+SS-MoA: Advances in Materials and Analysis in Heterogeneous Catalysis I
- HC+AS+SS-ThM: Bridging Gaps III: Combined Theory and Experiment in Catalysis
- HC+AS+SS-TuA: Bridging Gaps I: Structural and Dynamic Effects in Catalysis
- HC+AS+SS-TuM: Energetic Processes and Tailored Surfaces in Heterogeneous Catalysis
- HC+AS+SS-WeA: Bridging Gaps II: Single Atom Alloys and Desirable Defects
- HC+AS+SS-WeM: Advances in Materials and Analysis in Heterogeneous Catalysis II
- HC-ThP: Heterogenous Catalysis Poster Session
Magnetic Interfaces and Nanostructures (MI)
- MI+2D+TF-ThM: Quantum Materials (2D)
- MI-TuA: Topological Insulator Heterostructures
- MI-TuP: Magnetic Interfaces and Nanostructures Poster Session
- MI-WeM: Spin Landscape I (Magnetic Structures in Real and Momentum Space)
- MI-WeA: Spin Landscape II (Magnetic Structures in Real and Momentum Space)
Manufacturing Science and Technology (MS)
- MS+AP+AS+TF-MoA: Advanced Characterization and Metrology for 3D and ML for Microelectronics Materials Discovery
- MS+HI-MoM: Machine Learning for Microelectronics Manufacturing Process Control and Materials Discovery R&D
- MS-TuP: Manufacturing Science and Technology Poster Session
MEMS and NEMS (MN)
- MN+2D-MoA: Emerging Materials and Structures for MEMS/NEMS Devices
- MN+AS+NS+QS+SE-MoM: Dynamics and Engineering of MEMS/NEMS
- MN-TuP: MEMS and NEMS Poster Session
Mini Symposium on 2D Materials Synthesis (MS-2DMS)
- MS-2DMS+2D+EM+NS-TuM: Direct Growth of 2D Materials Including CVD and MBE
Nanoscale Science and Technology (NS)
- NS+AP+BI+SS-WeM: Frontiers in Scanning Probe Microscopy Including Machine Learning
- NS1+AS+EM-MoA: Correlative Microscopy for Nanoscale Characterization
- NS1+BI-WeA: Nanopore Sensing and Fabrication Operation and Metrology of Biodevices
- NS1+QS-MoM: Fabrication, Testing and Metrology of Quantum Devices and Systems
- NS2+AP+BI-MoA: Fabrication and Operation of Nano-Systems
- NS2+AS+EM+SS-MoM: Quantum Based Sensors and Metrology
- NS2+AS+EM-WeA: Scanning Probe Metrology of 1D and 2D Materials
- NS3+EM+TF-MoM: Nanophotonics, Metasurfaces and Plasmonic Systems Including Inverse Design Methods
- NSP-SuA: Nanoscale Science and Technology Plenary Session (ALL-INVITED SESSION)
- NS-TuP: Nanoscale Science and Technology Poster session
New Trends on Structural and Electronic Characterization of Materials, Interfaces, and Surfaces (LS)
- LS1+2D+AS+EM+QS+SS-TuA: Operando Catalysis and Energy Systems
- LS2+2D+AS+TF-TuA: Role of Defects in Materials
- LS-TuP: New Trends on Structural and Electronic Characterization of Materials Interfaces and Surfaces Using Synchrotron and FEL-Based Radiation Sources Poster Session
Plasma Science & Technology (PS)
- PS+AS-MoA: Plasma Chemistry and Catalysis
- PS1+AP+TF-WeM: Plasma Deposition and ALD Processes for Coatings and Thin Films
- PS1+AP-WeA: Plasma Assisted Atomic Layer Etching
- PS1+MS+SS-FrM: Modelling of Plasmas and Plasma Driven Processes‚ and Plasma-Surface Interactions II
- PS1+NS-TuM: Advanced Plasma Patterning: EUV-Based Multipatterning and Alternative Patterning Approaches (Imprints DSAs Etc.)
- PS1+TF-TuA: Plasma Processing for Advanced Emerging Memory Technologies Advanced Packaging and Heterogeneous Integration
- PS2+AS+SS-TuA: Plasma-Surface Interactions
- PS2+MS-TuM: Modelling of Plasmas and Plasma Driven Processes and Machine Learning
- PS2+SE-FrM: Plasma Sources, Diagnostics, Sensors and Control
- PS2+SE-WeA: Atmospheric Pressure Plasmas and their Applications
- PS2+TF-WeM: Plasma Processes of Non-Silicon Related Semiconductors for Energy-Efficient Devices in Power, Photovoltaics and Optoelectronics Applications
- PS-MoM: Plasmas for the Environment and Sustainability: Plasmas-Liquid Interactions‚ Water‚ Air‚ Soil Treatment
- PS-ThA: Harnessing the Power of Plasmas for Real-World Applications: PSTD Award Lectures
- PS-ThM: Plasma Processing for Advanced Semiconductor Devices
- PS-TuP: Plasma Science and Technology Poster Session
Quantum Information Science (QS)
- QS+AP+EM+MN+NS+SS-ThM: Systems and Devices for Quantum Computing
- QS+EM+MN+NS-ThA: The Quantum Metrology Revolution
- QS+EM+MN+NS-WeA: Systems and Devices for Quantum Information
- QS-ThP: Quantum Information Science Poster Session
Radiation Effects on Materials (RE)
- RE+AS-FrM: Materials Analysis and Characterization with Radiation
Smart Multifunctional Materials for Nanomedicine (SM)
- SM-WeM: Smart Multifunctional Materials for Nanomedicine and Theranostics
- SM-ThP: Smart Multifunctional Materials for Nanomedicine and Theranostics Poster Session
Spectroscopic Ellipsometry (EL)
- EL+AS+EM-TuM: Optical Characterization of Thin Films and Nanostructures
- EL1+AS+EM-TuA: Emerging Technological Advances and Breakthroughs of Spectroscopic Ellipsometry
- EL2+EM-TuA: Spectroscopic Ellipsometry: Novel Applications and Theoretical Approaches
- EL-TuP: Spectroscopic Ellipsometry Poster Session
Surface Science (SS)
- SS+2D+AS-TuA: Structures Adsorption and Reaction at 2D Material Surfaces
- SS+AS+SE-ThA: ALD and CVD Surface Chemistry
- SS+AS+TF-MoM: Dynamics and Mechanisms at Surfaces and Interfaces
- SS+AS-MoA: Molecular Organization at Surfaces
- SS+AS-WeA: Memorial Session in Honor of Patricia Thiel I
- SS+AS-ThM: Memorial Session in Honor of Patricia Thiel II
- SS1+AS+HC-FrM: Oxide Surface Structure and Reactivity
- SS1+HC-WeM: Alloy Surface Reactivity
- SS2+AS+HC-WeM: Nanoparticle Surfaces
- SS2+CA+AS-FrM: Environmental Atmospheric and Astronomical Surfaces
- SS-TuM: Liquid/Solid Interfaces and Electrochemistry
- SS-TuP: Surface Science Poster Session
Thin Films (TF)
- TF+AP-ThM: Novel ALD CVD Precursors, Processes Deposited Morphologies, and Substrate Architectures
- TF+AS-ThA: In-Situ Characterization of Thin Films and Interfaces
- TF+EM-MoA: Thin Films for Optics, Photonics, Metamaterials, and Soft Electronics
- TF+EM-MoM: Microelectronics and Spintronics Application
- TF1+AP: Manufacturing and Scale-Up of CVD and (Spatial) ALD
- TF1+PS-FrM: Plasmas PVD and HIPIMS Processes for Emerging and Advanced Materials
- TF1+SE+SS-ThM: Nucleation and Interface Phenomena in Thin Films
- TF1+SE-WeM: Vapor Deposition and Vapor Infiltration of Organic, Polymeric, and/or Hybrid Materials
- TF2+2D-TuA: Low Dimension Material Application
- TF2+AP+SE+SS-WeM: ALD and CVD: Surface Reactions, Mechanisms, and Kinetics
- TF2+EM-FrM: Wide and Ultra-Wide Bandgap Thin Films: Advances in Deposition and Novel Materials
- TF2-WeA: Solution Based and Graphene or Polymer Deposition Techniques
- TF3+MS-WeM: Simulations and Machine Learning Applications for Thin Films
- TF-ThP: Thin Film Poster Session
- TF-TuM: Growth in 3D High Aspect Ratio and Nanostructured Materials
Vacuum Technology (VT)
- VT-MoM: Vacuum Measurement and Gas Analysis and Vacuum Technology for Quantum Applications
- VT-MoA: Vacuum Technology for Accelerators
- VT-TuM: Vacuum Technology for Large Vacuum Systems
- VT-TuA: Vacuum Pumping Leak Detection and Modeling