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Division: Thin Film (TF)

The Thin Film Division (TF)offers several core oral sessions and one poster session. A broad range of outstanding invited speakers will cover the breadth of thin film science, thin film deposition, thin film interfaces, technology, and applications.

We have several sessions dedicated to ALD and CVD, encompassing from surface reactions and growth mechanisms to novel processes, precursors, scale-up, and emerging applications, and sessions dedicated to novel materials by a wide range of deposition processes, including epitaxial films and interfaces, PVD and solution-based methods. The application of simulation and machine learning to semiconductor processing and metrology will be discussed thanks to the invited lecture of Dr. Rafael Jaramillo (MIT) who will try to answer the question: what an experimentalist needs from computational materials science (including machine learning)? The division also features a session on interfacial phenomena on thin film growth with an invited talk from Dr. Mariona Coll (ICMAB-CSIC) showing opportunities of Complex Oxides Prepared by ALD.

Additionally, the division has a strong focus on the application of thin films, including microelectronics, battery and spintronics applications, interfaces and contacts, flexible electronics, plasmonic, photonic, and metamaterials, energy, and catalysis. It has also a session dedicated to low dimension materials. Specifically, to address this year’s symposium theme the division is introducing two new sessions on perfectly imperfect materials and imperfect Heusler Alloys for spintronics. This includes an invited talk from Dr. Mari Napari (Univ. of Southampton) on “The electrical and magnetic properties of nonstoichiometric Nickel Oxide thin films”, and an invited talk from Prof. Avik Ghosh (Univ. of Virginia) on “Designer Heusler Half-Metals for Ultra-Fast Spintronic”.

Finally, the division continues its focus on organic and hybrid materials, including the modification of polymers using vapor infiltration methods and the vapor deposition of functional polymer films. A good illustration will be the invited talk from Prof. Dr. Trisha L. Andrew (Univ. of Massachusetts Amherst) on CVD of Soft Materials for Garment-Integrated Sensor Systems and Plant Electronics.

Again, this year, we will host a student-focused session to highlight the Harper Award candidates in which the student finalists will present their work in an interactive “TEDTalk” type of forum.

TF+AP-ThM: Novel ALD CVD Precursors, Processes, Deposited Morphologies, and Substrate Architectures

  • Mari Napari, University of Southampton, UK, “The Electrical and Magnetic Properties of Nonstoichiometric Nickel Oxide Thin Films”

TF+EM-MoM: Microelectronics and Spintronics Application

  • Avik Ghosh, University of Virginia, “Designer Heusler Half-Metals for Ultra-Fast Spintronics”
  • Ivona Z. Mitrovic, University of Liverpool, UK, “Rare Earth Thin Oxide Films for Sustainable Energy”
  • Vince Sokalski, Carnegie-Mellon University, “Magnetic Multi-Layer Thin Films for Future Skyrmion-Based Memory”

TF1+PS-FrM: Plasma, PVD and HIPIMS Processes for Emerging and Advanced Materials

TF2-WeA: Solution Based and Graphene or Polymer Deposition Techniques

TF2+2D-TuA: Low Dimension Material Application

  • Stephan Hofmann, University of Cambridge, UK, ” Operando and High-throughput Approaches to Advance Integrated Process Technology of Atomically Thin Device Materials “

TF2+AP+SE+SS-WeM: ALD and CVD: Surface Reactions, Mechanisms, and Kinetics

  • Laura Nyns, IMEC, Belgium, “Ald of Chalcogenide and III-V Materials for Memory Applications”

TF1+SE+SS-ThM: Nucleation, and Interface Phenomena in Thin Films

  • Mariona Coll, ICMAB-CSIC, Spain, “Opportunities of Complex Oxides Prepared by Atomic Layer Depositions”

TF3+MS-WeM: Simulations and Machine Learning Applications for Thin Films

  • Rafael Jaramillo, MIT, “What an Experimentalist Needs from Computational Materials Science (Including Machine Learning) – Studies in Semiconductor Processing and Metrology”

TF+AS-ThA: In-Situ Characterization of Thin Films and Interfaces

TF-TuM: Growth in 3D, High Aspect Ratio and Nanostructured Materials

  • Neil Dasgupta, University of Michigan, “Tailoring 3-D Nanomaterial Architectures Using ALD: Bridging Scales from Atoms to Bulk”

TF2+EM-FrM: Wide and Ultra-Wide Bandgap Thin Films: Advances in Deposition and Novel Materials

  • Zlako Sitar, North Carolina State University, “AlGaN, An Enabling Ultra-Wide Bandgap Semiconductor”

TF1+SE-WeM: Vapor Deposition and Vapor Infiltration of Organic, Polymeric, and/or Hybrid Materials

  • Trisha L. Andrew, University of Massachusetts Amherst, “Chemical Vapor Deposition of Soft Materials for Garment-Integrated Sensor Systems and Plant Electronics”

TF+EM-MoA: Thin Films for Optics, Photonics, Metamaterials, and Soft Electronics

  • Michelle Povinelli, University of Southern California, “Strategies for Achieving Tunable Infrared Emission in III-V Materials”

TF-ThP: Thin Film Poster Session

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Key Dates

Major Awards Deadline:
March 31, 2022

Student Awards Deadline:
May 31, 2022

Late-Breaking Abstract Submission Deadline:
September 12, 2022

Early Registration Deadline:
September 30, 2022

Hotel Deadline Extension:
October 26, 2022

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

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